SMSC Launches MediaLB Device Interface Macro IP Supporting 6-Pin MediaLB

Hauppauge, New York - February 1, 2010 - SMSC (NASDAQ: SMSC), a leading semiconductor company providing Smart Mixed-Signal Connectivity(tm) solutions, today announced the availability of its OS62420 MediaLB(r) Device Interface Macro IP including 6-pin support.

This new IP is designed specifically to meet high-performance data transfer requirements and offers efficient, seamless integration into systems-on-chip (SoCs). The macro offers a complete MediaLB device supporting both single-ended MediaLB 3-Pin and additionally the new differential MediaLB 6-Pin interfaces to Media Oriented Systems Transport (MOST(r)) Intelligent Network Controllers (INICs). The interface offers max. 1024 frame samples (FS) equaling 49.2 MBIt/s in a 48kHz MOST network in MediaLB 3-Pin mode and max. 8192 FS equaling 330 MBIt/s in MediaLB 6-Pin mode. The macro features an Advanced Microcontroller Bus Architecture (AMBA(r)) 2.0-compliant user interface (AMBA high performance bus and AMBA peripheral bus) for connection to the SoC's system architecture.

MediaLB is a chip-to-chip interface that enables connectivity of application ICs with the MOST network interface controllers. MediaLB device interfaces can be implemented royalty-free. MediaLB has gained wide support with major semiconductor companies and currently there are 23 licensees using the MediaLB standard in their automotive infotainment products. Additional information is available for download at www.medialb.de.

Key features of the OS62420 device interface macro block include:

  • Implements MediaLB specification-compliant link layer
  • Supports all MediaLB/MOST network data types including: control, asynchronous, synchronous and isochronous
  • Supports 63 logical channels, configurable for any channel type and direction
  • Flexible and scalable implementation designed for all MOST network system configurations (MOST25/50/150)
  • Supports single-ended 3-Pin and differential 6-Pin physical layers
  • Speed modes for MediaLB 3-Pin (@ 48kHz MOST network): 256FS (12.3 Mbit/s), 512FS (24.6 Mbit/s), 1024FS (49.2 Mbit/s)
  • Speed modes for MediaLB 6-Pin (@ 48kHz MOST network) 2048FS (89.1 Mbit/s), 3072FS (133.6 Mbit/s), 4096FS (179.7 Mbit/s), 6144FS (247.3 Mbit/s), 8192FS (330.2 Mbit/s)
  • AMBA high-performance bus
  • AMBA specification revision 2.0 AHB-compliant bus master interface for data transfer to and from system memory
  • AMBA peripheral bus
  • AMBA Specification Revision 2.0 APB-compliant slave interface for configuration
  • Supports burst-capable DMA mode
  • Supports customer-implemented RAM used for channel data buffering

Image: This new OS62420 MediaLB® Device Interface Macro IP is designed specifically to meet high-performance data transfer requirements and offers efficient, seamless integration into systems-on-chip (SoCs). (2 MB) >>

About SMSC's Automotive Product Line

SMSC's Automotive Information Systems is a supplier of TrueAuto(tm) infotainment and information semiconductor solutions to major automakers, including Audi, BMW, Daimler, Hyundai/Kia, Jaguar, Land Rover, Porsche, Toyota and Volvo. SMSC is a founding member of the MOST Cooperation, a cooperative of automakers, automotive systems architects and manufacturers and key components suppliers working to extend and refine the MOST(r) standard for the evolving requirements of automotive multimedia networking. Additional information is available at www.smsc-ais.com.

About SMSC

SMSC is a leading developer of Smart Mixed-Signal Connectivity(tm) solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. SMSC's feature-rich products drive a number of industry standards and include USB, MOST(r) automotive networking, embedded system control and analog solutions, including thermal management and RightTouch(tm) capacitive sensing. SMSC is headquartered in New York and has offices and research facilities in North America, Asia, Europe and India. Additional information is available at www.smsc.com.

Forward Looking Statements
Except for historical information contained herein, the matters discussed in this announcement are forward-looking statements about expected future events and financial and operating results that involve risks and uncertainties. These uncertainties may cause our actual future results to be materially different from those discussed in forward-looking statements. Our risks and uncertainties include the timely development and market acceptance of new products; the impact of competitive products and pricing; our ability to procure capacity from our suppliers and the timely performance of their obligations, commodity prices, interest rates and foreign exchange, potential investment losses as a result of liquidity conditions, the effects of changing economic and political conditions in the market domestically and internationally and on our customers; our relationships with and dependence on customers and growth rates in the personal computer, consumer electronics and embedded and automotive markets and within our sales channel; changes in customer order patterns, including order cancellations or reduced bookings; the effects of tariff, import and currency regulation; potential or actual litigation; and excess or obsolete inventory and variations in inventory valuation, among others. In addition, SMSC competes in the semiconductor industry, which has historically been characterized by intense competition, rapid technological change, cyclical market patterns, price erosion and periods of mismatched supply and demand.

Our forward looking statements are qualified in their entirety by the inherent risks and uncertainties surrounding future expectations and may not reflect the potential impact of any future acquisitions, mergers or divestitures. All forward-looking statements speak only as of the date hereof and are based upon the information available to SMSC at this time. Such statements are subject to change, and the Company does not undertake to update such statements, except to the extent required under applicable law and regulation. These and other risks and uncertainties, including potential liability resulting from pending or future litigation, are detailed from time to time in the Company's reports filed with the SEC. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled "Other Factors That May Affect Future Operating Results" or "Risk Factors" for a more complete discussion of these and other risks and uncertainties.

SMSC and MOST are registered trademarks and Smart Mixed-Signal Connectivity, TrueAuto and RightTouch are trademarks of Standard Microsystems Corporation.

Media Contact Europe

hueggenberg gbr
Mandy Ahlendorf
T +49 8151 55 50 09 11 E presse(at)hueggenberg.com
W www.hueggenberg.com

SMSC Automotive Information Systems
Rolf Hoffmeyer-Zlotnik
Bannwaldallee 48
76185 Karlsruhe (Germany)
T +49 721 625 37 224
E Rolf.Hoffmeyer-Zlotnik(at)smsc.com
W www.smsc.com

Media Contact United States

SMSC
Carolynne Borders
Senior Director, Corporate Communications & Investor Relations
T +1 631-435-6626
E carolynne.borders(at)smsc.com